Broadcom Expands 200G DSP Portfolio for AI Infrastructure with New Low-Power Optical Solutions

Broadcom Inc. (NASDAQ: AVGO) introduced two new additions to its 200G/lane DSP PHY portfolio—Sian3 and Sian2M—tailored to meet the performance and power demands of next-generation AI and machine learning clusters.

Sian3 is a 3nm DSP PHY optimized for single-mode fiber (SMF) applications, delivering the industry's lowest power consumption for 800G and 1.6T optical transceivers. It offers over 20% power savings compared to its predecessor and supports both EML and silicon photonics (SiP) modules.

Sian2M is the industry's first 200G/lane DSP with integrated VCSEL drivers for short-reach multi-mode fiber (MMF) links. Built on Broadcom’s established VCSEL technology, it offers a highly efficient solution for short-distance connectivity within AI clusters.

Together with its portfolio of 200G EML, CWL lasers, and VCSELs, Broadcom’s new DSPs enable rapid deployment of low-power, high-bandwidth optical interconnects across AI networks. Early access samples of Sian3 and Sian2M are now available, with production ramp for Sian3 expected in Q3 2025.

Broadcom emphasized that these solutions are instrumental in reducing the power barriers limiting AI cluster scalability while meeting the growing bandwidth demands of emerging 102T switch systems and 1.6T optical transceivers.