Broadcom Expands Optical Connectivity Solutions for AI Infrastructure at OFC 2025

Broadcom has announced a significant expansion of its optical interconnect portfolio aimed at advancing AI infrastructure, unveiled at the 2025 Optical Fiber Communications Conference (OFC). The company showcased innovations including co-packaged optics, 200G/lane DSP and SerDes, PCIe Gen6 over optics, and 400G EML, emphasizing its commitment to enable future 200-terabit optical interconnects.

The technologies aim to meet increasing demands for high bandwidth, low latency, and energy efficiency in AI data centers. Among the highlights are the industry’s first 6.4-Tbps optics for AI accelerators (XPU-CPO), a 3nm 200G/lane DSP (Sian3), PCIe Gen6 optical connectivity, and a new 800G AEC solution for extending cable reach beyond seven meters.

Broadcom is collaborating with over 15 partners to demonstrate the practical deployment of these solutions across the show floor. The company is also contributing to key panel discussions and presentations on optical interconnect trends, co-packaged optics manufacturing, and cost-optimized AI cluster scaling.

This development marks Broadcom’s continued leadership in enabling scalable, power-efficient AI infrastructure through advanced optical connectivity solutions.