Applied Materials Invests in BE Semiconductor to Advance Hybrid Bonding Innovation

Applied Materials has acquired 9% of BE Semiconductor Industries N.V. (Besi), strengthening their ongoing collaboration to develop next-generation hybrid bonding solutions for advanced chip packaging. The partnership aims to address the growing demand for high-performance and energy-efficient semiconductors.

Hybrid bonding technology enables copper-to-copper connections between chiplets, improving data transfer efficiency, reducing power consumption, and supporting more compact system designs. The joint development between Applied and Besi has resulted in a fully integrated system that combines precise wafer processing with high-speed die placement and assembly, positioning it for large-scale manufacturing.

This strategic investment highlights Applied’s commitment to delivering cutting-edge packaging solutions that support the semiconductor industry’s evolution, particularly in areas such as artificial intelligence and high-performance computing. Applied does not plan to seek board representation at Besi or increase its shareholding.