Ansys Certifies Thermal and Multiphysics Tools for Intel 18A and 3D-IC Designs

Ansys announced that its simulation tools—including RedHawk-SC, Totem, and the new HFSS-IC Pro—are now certified for Intel's 18A transistor process and 3D-IC technologies. This collaboration with Intel Foundry supports high-performance applications in AI and HPC by enabling thermal, power integrity, and electromagnetic modeling. The certification also covers Intel’s EMIB and EMIB-T technologies. Ansys joins the Intel Foundry Chiplet Alliance to promote secure, interoperable multi-die design ecosystems and is progressing further certification for Intel 18A-P and 14A-E process nodes.