Synopsys announced a major collaboration with Intel Foundry to advance angstrom-scale chip design using Intel's 18A and 18A-P process technologies.

Synopsys has developed production-ready digital and analog design flows and the broadest IP portfolio for these advanced nodes, including support for RibbonFET and PowerVia technologies. The partnership also includes optimized tools for Intel’s new EMIB-T advanced packaging, enabling high-density, multi-die chip design.

Synopsys is also contributing to Intel's upcoming 14A-E node through early co-optimization efforts and has expanded its involvement in Intel’s ecosystem by joining both the Intel Foundry Accelerator Design Services Alliance and the new Intel Foundry Chiplet Alliance. These efforts aim to accelerate AI and high-performance computing chip development and foster wider adoption of Intel’s foundry services.